-
1
-
-
0000864810
-
State-of-the-art and trends in the thermal packaging of electronic equipment
-
Bar-Cohen, A., 1992. "State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment," ASME J. Electron. Packag., 114, pp. 257-270.
-
(1992)
ASME J. Electron. Packag.
, vol.114
, pp. 257-270
-
-
Bar-Cohen, A.1
-
2
-
-
0002739757
-
Stress analysis of thermal inclusions with interior voids and cracks
-
Ru, C. Q., 2000, "Stress Analysis of Thermal Inclusions With Interior Voids and Cracks," ASME J. Electron. Packag., 122, pp. 192-199.
-
(2000)
ASME J. Electron. Packag.
, vol.122
, pp. 192-199
-
-
Ru, C.Q.1
-
3
-
-
0001764380
-
Analysis of bi-metal thermostats
-
Timoshenko, S., 1925, "Analysis of Bi-Metal Thermostats," J. Opt. Soc. Am., 11, pp. 233-255.
-
(1925)
J. Opt. Soc. Am.
, vol.11
, pp. 233-255
-
-
Timoshenko, S.1
-
4
-
-
0018444760
-
Thermal stress in bonded joints
-
Chen, W. T., and Nelson, C. W., 1979, "Thermal Stress in Bonded Joints," IBM J. Res. Dev., 23, pp. 179-188.
-
(1979)
IBM J. Res. Dev.
, vol.23
, pp. 179-188
-
-
Chen, W.T.1
Nelson, C.W.2
-
5
-
-
0020183155
-
Boundary-layer effects in composite laminates. Part 1-free-edge stress singularities. Part 2-free-edge stress solution and basic characteristics
-
Wang, S. S., and Choi, I., 1982, "Boundary-Layer Effects in Composite Laminates. Part 1-Free-Edge Stress Singularities. Part 2-Free-Edge Stress Solution and Basic Characteristics," ASME J. Appl. Mech., 49, pp. 541-560.
-
(1982)
ASME J. Appl. Mech.
, vol.49
, pp. 541-560
-
-
Wang, S.S.1
Choi, I.2
-
6
-
-
0022900363
-
Stresses in bi-metal thermostats
-
Suhir, E., 1986, "Stresses in Bi-Metal Thermostats," ASME J. Appl. Mech., 53, pp. 657-660.
-
(1986)
ASME J. Appl. Mech.
, vol.53
, pp. 657-660
-
-
Suhir, E.1
-
7
-
-
0023984412
-
An approximate analysis of stresses in multilayered elastic thin films
-
Suhir, E., 1988, "An Approximate Analysis of Stresses in Multilayered Elastic Thin Films," ASME J. Appl. Mech., 55, pp. 143-148.
-
(1988)
ASME J. Appl. Mech.
, vol.55
, pp. 143-148
-
-
Suhir, E.1
-
8
-
-
0024734854
-
Interfacial stresses in bimetal thermostats
-
Suhir, E., 1989, "Interfacial Stresses in Bimetal Thermostats," ASME J. Appl. Mech., 56, pp. 595-600.
-
(1989)
ASME J. Appl. Mech.
, vol.56
, pp. 595-600
-
-
Suhir, E.1
-
9
-
-
0024858752
-
Thermal stress analysis of laminate using higher-order theory in each layer
-
Cho, K. N., Striz, A. G., and Bert, C. W., 1989, "Thermal Stress Analysis of Laminate Using Higher-Order Theory in Each Layer," J. Therm. Stresses, 12, pp. 321-332.
-
(1989)
J. Therm. Stresses
, vol.12
, pp. 321-332
-
-
Cho, K.N.1
Striz, A.G.2
Bert, C.W.3
-
10
-
-
0024736944
-
Thermal stresses at the edge of a bimetallic thermostat
-
Kuo, A. Y., 1989, "Thermal Stresses at the Edge of a Bimetallic Thermostat," ASME J. Appl. Mech., 56, pp. 585-589.
-
(1989)
ASME J. Appl. Mech.
, vol.56
, pp. 585-589
-
-
Kuo, A.Y.1
-
11
-
-
85024591157
-
Mechanical modeling of multilayered films on an elastic substrate part I: Analysis. Part II: Results and discussion
-
Erdogan, F., and Joseph, P. F., 1990. "Mechanical Modeling of Multilayered Films on an Elastic Substrate Part I: Analysis. Part II: Results and Discussion," ASME J. Electron. Packag., 112, pp. 309-326.
-
(1990)
ASME J. Electron. Packag.
, vol.112
, pp. 309-326
-
-
Erdogan, F.1
Joseph, P.F.2
-
12
-
-
0031166703
-
Thermal stresses in layered electronic assemblies
-
Jiang, Z. Q., Huang, Y., and Chandra, A., 1997. "Thermal Stresses in Layered Electronic Assemblies," ASME J. Electron. Packag., 119, pp. 127-132.
-
(1997)
ASME J. Electron. Packag.
, vol.119
, pp. 127-132
-
-
Jiang, Z.Q.1
Huang, Y.2
Chandra, A.3
-
13
-
-
0345959892
-
Realistic modeling of edge effect stresses in bimetallic elements
-
Eischen, J. W., Chung, C., and Kim, J. H., 1990, "Realistic Modeling of Edge Effect Stresses in Bimetallic Elements," ASME J. Electron. Packag., 112, pp. 16-23.
-
(1990)
ASME J. Electron. Packag.
, vol.112
, pp. 16-23
-
-
Eischen, J.W.1
Chung, C.2
Kim, J.H.3
-
14
-
-
0006039445
-
Thermal stresses in compliantly jointed materials
-
Glaser, J. G., 1990. "Thermal Stresses in Compliantly Jointed Materials," ASME J. Electron. Packag., 112, pp. 24-29.
-
(1990)
ASME J. Electron. Packag.
, vol.112
, pp. 24-29
-
-
Glaser, J.G.1
-
15
-
-
84881216153
-
Deformation in multilayer stacked assemblies
-
Pan, T. Y., and Pao, Y. H., 1990, "Deformation in Multilayer Stacked Assemblies," ASME J. Electron. Packag., 112, pp. 30-34.
-
(1990)
ASME J. Electron. Packag.
, vol.112
, pp. 30-34
-
-
Pan, T.Y.1
Pao, Y.H.2
-
16
-
-
0026172299
-
Interfacial shear and peel stresses in multilayered thin stacks subjected to uniform thermal loading
-
Pao, Y. H., and Eisele, E., 1991, "Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading," ASME J. Electron. Packag., 113, pp. 164-172.
-
(1991)
ASME J. Electron. Packag.
, vol.113
, pp. 164-172
-
-
Pao, Y.H.1
Eisele, E.2
-
17
-
-
0026401946
-
The various approximations of the bimetallic thermostatic strip
-
Pionke, C. D., and Wempner, G., 1991, "The Various Approximations of the Bimetallic Thermostatic Strip," ASME J. Appl. Mech., 58, pp. 1015-1020.
-
(1991)
ASME J. Appl. Mech.
, vol.58
, pp. 1015-1020
-
-
Pionke, C.D.1
Wempner, G.2
-
18
-
-
0007524705
-
The stresses in a thermally loaded bimaterial interface
-
Tsai, M. Y., and Morton, J., 1991, "The Stresses in a Thermally Loaded Bimaterial Interface," Int. J. Solids Struct., 28, pp. 1053-1075.
-
(1991)
Int. J. Solids Struct.
, vol.28
, pp. 1053-1075
-
-
Tsai, M.Y.1
Morton, J.2
-
19
-
-
0027000961
-
Interlaminar stresses in layered beams
-
Mirman, B., 1992, "Interlaminar Stresses in Layered Beams," ASME J. Electron. Packag., 114, pp. 389-396.
-
(1992)
ASME J. Electron. Packag.
, vol.114
, pp. 389-396
-
-
Mirman, B.1
-
20
-
-
84991759497
-
Thermal stresses in a bimaterial joint: An experimental analysis
-
Post, D., Wood, J. D., Han, B., Parks, V. J., and Gerstle, F. P., 1994, "Thermal Stresses in a Bimaterial Joint: An Experimental Analysis," ASME J. Appl. Mech., 61, pp. 192-198.
-
(1994)
ASME J. Appl. Mech.
, vol.61
, pp. 192-198
-
-
Post, D.1
Wood, J.D.2
Han, B.3
Parks, V.J.4
Gerstle, F.P.5
-
21
-
-
0019284501
-
A theory of elastic foundations
-
Bharatha, S., and Levinson, M., 1980. "A Theory of Elastic Foundations," Arch. Ration. Mech. Anal., 74, pp. 249-266.
-
(1980)
Arch. Ration. Mech. Anal.
, vol.74
, pp. 249-266
-
-
Bharatha, S.1
Levinson, M.2
-
22
-
-
0021578376
-
On the formal development of elastic foundation models
-
in English
-
Kerr, A. D., 1984, "On the Formal Development of Elastic Foundation Models," Ingenieur-Archiv, 54, pp. 455-464 (in English).
-
(1984)
Ingenieur-Archiv
, vol.54
, pp. 455-464
-
-
Kerr, A.D.1
-
23
-
-
0028444237
-
Bending of plates on thin compressible foundations
-
Bert, C. W., 1994, "Bending of Plates on Thin Compressible Foundations," ASME J. Appl. Mech., 61, pp. 497-498.
-
(1994)
ASME J. Appl. Mech.
, vol.61
, pp. 497-498
-
-
Bert, C.W.1
-
24
-
-
0017915950
-
The effect of adhesive layers on the fracture of laminated structures
-
Gecit, M. R., and Erdogan, F., 1978, "The Effect of Adhesive Layers on the Fracture of Laminated Structures," ASME J. Eng. Mater. Technol., 100, pp. 2-9.
-
(1978)
ASME J. Eng. Mater. Technol.
, vol.100
, pp. 2-9
-
-
Gecit, M.R.1
Erdogan, F.2
-
25
-
-
0031186215
-
End effects in multilayered orthotropic strips with imperfect bonding
-
Tullini, N., Savoia, M., and Horgan, C. O., 1997, "End Effects in Multilayered Orthotropic Strips With Imperfect Bonding," Mech. Mater., 26, pp. 23-34.
-
(1997)
Mech. Mater.
, vol.26
, pp. 23-34
-
-
Tullini, N.1
Savoia, M.2
Horgan, C.O.3
-
26
-
-
0008966228
-
The multilayer-modified stoney's formula for laminated polymer composites on a silicon substrate
-
Kim, J. S., Paik, K. W., and Oh, S. H., 1999, "The Multilayer-Modified Stoney's Formula for Laminated Polymer Composites on a Silicon Substrate," J. Appl. Phys., 86, pp. 5474-5479.
-
(1999)
J. Appl. Phys.
, vol.86
, pp. 5474-5479
-
-
Kim, J.S.1
Paik, K.W.2
Oh, S.H.3
-
27
-
-
0035307597
-
Analysis of interfacial thermal stresses in a trimaterial assembly
-
Suhir, E., 2001, "Analysis of Interfacial Thermal Stresses in a Trimaterial Assembly," J. Appl. Phys., 89, pp. 3685-3694.
-
(2001)
J. Appl. Phys.
, vol.89
, pp. 3685-3694
-
-
Suhir, E.1
|