Adhesive layer shrinkage in bonds subjected to thermal cycling

Mechanics Time-Dependent Materials

Volumn 7, Issue 1, 2003, Pages 21-39

  Dillard, David A ^a   Guo, Shu ^a   Chen, Buo ^a,b   Yu, Jang Horng ^a,c  

^a VIRGINIA STATE UNIVERSITY   (United States)

^b Materials Science and Tire Mechanics   (United States)

^c NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Adhesive bonds; Adhesive shrinkage; Debonding; Friction; Frictional hysteresis; Potting adhesive applications; Thermal cycling; Thermal ratcheting

Indexed keywords

COATINGS; DEBONDING; FRICTION; RESIDUAL STRESSES; SHRINKAGE; TENSILE STRESS; THERMAL CYCLING; VISCOELASTICITY; HYSTERESIS;

ADHESIVE BONDS; ADHESIVE SHRINKAGE; FRICTIONAL HYSTERESIS; POTTING ADHESIVE APPLICATIONS; THERMAL RATCHETING;

PLASTIC ADHESIVES; ADHESIVES;

EID: 0038345312     PISSN: 13852000     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1024003830960     Document Type: Article

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