Mechanical properties and microstructure of tin-silver-bismuth lead-free solder

Materials Transactions

Volumn 43, Issue 8, 2002, Pages 1808-1815

  Shimokawa, Hanae ^a   Soga, Tasao ^a   Serizawa, Koji ^a  

^a HITACHI LTD   (Japan)

Author keywords

Elongation; Impact resistance; Lead free solder; Tensile strength

Indexed keywords

DEFORMATION; GRAIN BOUNDARIES; IMPACT RESISTANCE; MICROSTRUCTURE; TENSILE STRENGTH; TIN ALLOYS;

LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0036698748     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1808     Document Type: Article

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