Melting and joining behavior of Sn/Ag and Sn-Ag/Sn-Bi plating on Cu core ball

Materials Transactions

Volumn 43, Issue 8, 2002, Pages 1833-1839

  Uenishi, Keisuke ^a   Kohara, Yasuhiro ^a   Sakatani, Shigeaki ^a   Saeki, Toshio ^a   Kobayashi, Kojiro F ^a   Yamamoto, Masaharu ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Ball grid array; Copper cored ball; Intermetallic compound; Lead free solder; Reaction layer; Shear strength

Indexed keywords

INTERFACES (MATERIALS); INTERMETALLICS; MELTING; MICROSTRUCTURE; SHEAR STRENGTH; TIN ALLOYS; TINNING;

BALL GRID ARRAY (BGA) PACKAGES;

SOLDERING ALLOYS;

EID: 0036699226     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1833     Document Type: Article

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