SCOPUS 정보 검색 플랫폼

Materials Transactions

Volumn 43, Issue 4, 2002, Pages 751-756

Effect of surface finishes on ball shear strength in BGA joints with Sn-3.5 mass% Ag solder

(4) Lee, Chang Bae a Lee, In Young a Jung, Seung Boo a Shur, Chang Chae a

a Sungkyunkwan University (South Korea)

Author keywords

Ball grid array (BGA) joint; Ball shear test; Fracture surface; Isothermal aging; Reliability

Indexed keywords

AGING OF MATERIALS; FAILURE ANALYSIS; FRACTURE TESTING; PLATING; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SUBSTRATES; THERMAL EFFECTS;

BALL GRID ARRAY; FRACTURE SURFACE; ISOTHERMAL AGING; MECHANICAL BALL SHEAR TEST; SURFACE FINISHES;

SOLDERED JOINTS;

EID: 0036543305 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.43.751 Document Type: Article

Times cited : (36)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.