Failure behavior of small outline J Lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test

Materials Chemistry and Physics

Volumn 87, Issue 2-3, 2004, Pages 285-291

  Wu, Pei Lin ^a   Huang, Meng Kuang ^a   Lee, Chiapyng ^a   Tzan, Shyh Rong ^b  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Fracture; Lead free solder; Surface finish; Thermomechanical fatigue

Indexed keywords

COATINGS; ELECTRONIC EQUIPMENT; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; FATIGUE OF MATERIALS; FRACTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; THERMOMECHANICAL TREATMENT; TIN;

LEAD-FREE SOLDERS; SOLDER MATRIX; SURFACE FINISH (SF); THERMOMECHANICAL FATIGUE;

LEAD;

EID: 4243128360     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2004.05.044     Document Type: Article

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