Low-Cycle Fatigue Prediction Model for Pb-Free Solder 96.5Sn-3.5Ag

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 329-333

  Kanchanomai, C ^a   Mutoh, Y ^b  

^a THAMMASAT UNIVERSITY   (Thailand)

^b NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

96.5Sn 3.5Ag; Coffin Manson model; Lead free solder material; Low cycle fatigue; Morrow energy model; Smith Watson Topper model

Indexed keywords

ELECTRONICS PACKAGING; EUTECTICS; FATIGUE OF MATERIALS; LEAD; MATHEMATICAL MODELS; SILVER ALLOYS; SURFACE MOUNT TECHNOLOGY; THERMAL EFFECTS; TIN ALLOYS;

LEAD-FREE SOLDER MATERIALS; LOW-CYCLE FATIGUE; MORROW ENERGY MODELS;

SOLDERING ALLOYS;

EID: 2342562541     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0139-1     Document Type: Article

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