Simple modeling and characterization of stress migration phenomena in Cu interconnects

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 45, Issue 2 A, 2006, Pages 714-719

  Tsuchikawa, Haruo ^a,b   Mizushima, Yoriko ^a   Nakamura, Tomoji ^a   Suzuki, Takashi ^a   Nakajima, Hirochika ^b  

^a FUJITSU LABORATORIES LTD   (Japan)

^b WASEDA UNIVERSITY   (Japan)

Author keywords

Cu interconnect; Finite element method; Grain boundary; Stress induced voiding; Stress migration

Indexed keywords

DIFFUSION; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; STRESS ANALYSIS;

CU INTERCONNECT; STRESS MIGRATION;

COPPER;

EID: 32244445698     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.45.714     Document Type: Article

References (36)

1. E. T. Ogawa, J. W. McPherson, J. A. Rosal, K. J. Dickerson, T.-C. Chiu, L. Y. Tsung, M. K. Jain, T. D. Bonifield, J. C. Ondrusek and W. R. McKee: Proc. 40th Int. Reliability Physics Symp., Dallas, 2002, p. 312.
2. K. Ishikawa, T. Iwasaki, T. Fujii, N. Nakajima, M. Miyauchi, T. Ohshima, J. Noguchi, H. Aoki and T. Saito: Proc. Int. Interconnect Technology Conf., San Francisco, 2003, p. 24.
3. K. Yoshida, T. Fujimaki, K. Miyamoto, T. Honma, H. Kaneko, H. Nakazawa and M. Morita: IEDM Tech. Dig., 2002, p. 753.
4. T. C. Huang, C. H. Yao, W. K. Wan, Chin C. Hsia and M. S. Liang: Proc. Int. Interconnect Technology Conf., San Francisco, 2003, p. 217.
5. M. Kawano, T. Fukase, Y. Yamamoto, T. Ito, S. Yokogawa, H. Tsuda, Y. Kunimune, T. Saitoh, K. Ueno and M. Sekine: Proc. Int. Interconnect Technology Conf., San Francisco, 2003, p. 210.
6. S. Matsumoto, A. Ishii, K. Tomita, K. Hashimoto, Y. Nishioka, M. Sekiguchi, A. Iwasaki, S. Isono, T. Satake, G. Okazaki, M. Fujisawa, M. Matsumoto, S. Yamamoto and M. Matsuura: Proc. Int. Interconnect Technology Conf., San Francisco, 2003, p. 262.
7. T. Tonegawa, M. Hiroi, K. Motoyama, K. Fujii and H. Miyamoto: Proc. Int. Interconnect Tech. Conf., San Francisco, 2003, p. 216.
8. M. Abe, N. Furutake, S. Saito, N. Inoue and Y. Hayashi: Jpn. J. Appl. Phys. 44 (2005) 2294.
9. A. von Glasow, A. H. Fischer, D. Bunel, G. Friese, A. Hausmann, O. Heitzsch, M. Hommel, J. Kriz, S. Penka, P. Raffin, C. Robin, H.-P. Sperlich, F. Ungar and A. E. Zitzelsberger: Proc. 41st Int. Reliability Physics Symp., Dallas, 2003, p. 146.
10. T. Harada, K. Kobayashi, M. Takahashi, K. Nii, A. Ikeda, T. Ueda and T. Yabu: Proc. Int. Interconnect Technology Conf., San Francisco, 2003, p. 92.
11. T. Suzuki, A. Uedono, T. Nakamura, Y. Mizushima, H. Kitada and Y. Koura: Proc. Int. Interconnect Technology Conf., San Francisco, 2004, p. 87.
12. C. J. Zhai, H. W. Yao, P. R. Besser, A. Marathe, R. C. Blish II, D. Erb, C. Hau-Riege, Sidharth and K. O. Taylor: Proc. 42nd Int. Reliability Physics Symp., Phoenix, 2004, p. 234.
13. C. Herring: J. Appl. Phys. 21 (1950) 437.
14. R. Huang, D. Gan and P. S. Ho: J. Appl. Phys. 97 (2005) 103532.
15. D. Edelstein, J. Heidenreich, R. Goldblatt, W. Cote, C. Uzoh, N. Lustig, P. Roper, T. McDevittt, W. Motsifft, A. Simon, J. Dukovic, R. Wachnik, H. Rathore, R. Schulz, L. Su, S. Lucet and J. Slatteryt: IEDM Tech. Dig., 1997, p. 773.
16. S.-J. Lee, S.-G. Lee, B.-S. Suh, H. Shin, N.-I. Lee, H.-K. Kang and G. Suh: Proc. Int. Interconnect Technology Conf., San Francisco, 2005, p. 108.
17. T. Oshima, K. Hinode, H. Yamaguchi, H. Aoki, K. Torii, T. Saito, K. Ishikawa, J. Noguchi, M. Fukui, T. Nakamura, S. Uno, K. Tsugane, J. Murata, K. Kikushima, H. Sekisaka, E. Murakami, K. Okuyama and T. Iwasaki: IEDM Tech. Dig., 2002, p. 757.
18. Rika Nenpyo, ed. National Astronomincal Observatory (Maruzen, Tokyo, 2004) [in Japanese].
19. D. Gan, G. Wang and P. S. Ho: Proc. Int. Interconnect Technology Conf., San Francisco, 2002, p. 271.
20. A. Tezaki, T. Mineta, H. Egawa and T. Noguchi: Proc. 28th Int. Reliability Physics Symp., New Orleans, 1990, p. 202.
21. D. Hull and D. E. Rimmer: Philos. Mag. 4 (1959) 673.
22. L. Martinez and W. D. Nix: Metall. Trans. A 13 (1982) 427.
23. T.-J. Chuang, K. I. Kagawa, J. R. Rice and L. B. Sills: Acta Metall. 27 (1979) 265.
24. R. Raj and M. F. Ashby: Acta Metall. 23 (1975) 653.
25. J. Weertman: Scr. Met. 7 (1973) 1129.
26. M. V. Speight and W. Beere: Met. Sci. 9 (1975) 190.
27. T.-J. Chuang and J. R. Rice: Acta Metall. 21 (1973) 1625.
28. A. Needleman and J. R. Rice: Acta Metall. 28 (1980) 1315.
29. W. D. Nix, K. S. Yu and J. S. Wang: Metall. Trans. A 14 (1983) 563.
30. J. P. Hirth and J. Lothe: Theory of Dislocations (McGraw-Hill, New York, 1978) p. 764.
31. M. Kato, H. Niwa, H. Yagi and H. Tsuchikawa: J. Appl. Phys. 68 (1990) 334.
32. A. H. Fischer and A. E. Zitzelsberger: Proc. 39th Int. Reliability Physics Symp., Orlando, 2001, p. 334.
33. J. W. McPherson and C. F. Dunn: J. Vac. Sci. Technol. B 5 (1987) 1321.
34. G. B. Alers, J. Sukamto, P. Woytowitz, X. Lu, S. Kailasam and J. Reid: Proc. 43rd Int. Reliability Physics Symp., San Jose, 2005, p. 36.
35. M. W. Lane, E. G. Liniger and J. R. Lloyd: J. Appl. Phys. 93 (2003) 1417.
36. T. Usui, T. Oki, H. Miyajima, K. Tabuchi, K. Watanabe, T. Hasegawa and H. Shibata: Proc. 42nd Int. Reliability Physics Symp., Phoenix, 2004, p. 246.