SCOPUS 정보 검색 플랫폼

Volumn , Issue , 2005, Pages 36-40

Stress migration and the mechanical properties of copper

Author keywords

[No Author keywords available]

Indexed keywords

COPPER INTERCONNECTS; COPPER THICKNESS; STRESS MIGRATION; VACANCY DIFFUSION;

DIFFUSION; ELASTICITY; ELECTRIC POWER SYSTEM INTERCONNECTION; ENERGY DISSIPATION; PLASTICITY; PLATING; STRESS ANALYSIS; TENSILE STRESS;

COPPER;

EID: 28744436721 PISSN: 15417026 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (28)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.