Effects of the metallurgical properties of upper Cu film on stress-induced voiding (SIV) in Cu dual-damascene interconnects

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 4 B, 2005, Pages 2294-2302

  Abe, Mari ^a   Furutake, Naoya ^a   Saito, Shinobu ^a   Inoue, Naoya ^a   Hayashi, Yoshihiro ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Coefficient of thermal expansion (CTE); Copper; Creep; Dual damascene interconnect; Finite element analysis; Stress hysteresis; Stress induced voiding (SIV)

Indexed keywords

CREEP; DEPOSITION; DIFFUSION; FINITE ELEMENT METHOD; HIGH TEMPERATURE EFFECTS; METALLIC FILMS; STRESS ANALYSIS; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE); DUAL-DAMASCENE INTERCONNECT; STRESS HYSTERESIS; STRESS-INDUCED VOIDING (SIV);

COPPER;

EID: 21244436375     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.2294     Document Type: Conference Paper

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