The quantitative assessment of stress-induced voiding in process qualification

IEEE International Reliability Physics Symposium Proceedings

Volumn 2001-January, Issue , 2001, Pages 334-340

  Fischer, A H ^a   Zitzelsberger, A E ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Aluminum; Current density; Electrical resistance measurement; Electromigration; Equations; Integrated circuit interconnections; Qualifications; Temperature; Tensile stress; Thermal stresses

Indexed keywords

ALUMINUM; CURRENT DENSITY; INTEGRATED CIRCUIT INTERCONNECTS; TEMPERATURE; TENSILE STRESS; THERMAL STRESS;

ELECTRICAL RESISTANCE MEASUREMENT; EQUATIONS; INTEGRATED CIRCUIT INTERCONNECTIONS; MEDIAN TIME OF FAILURES; PHENOMENOLOGICAL MODELING; QUALIFICATIONS; QUANTITATIVE ASSESSMENTS; STRESS-INDUCED VOIDING;

ELECTROMIGRATION;

EID: 84949815421     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2001.922924     Document Type: Conference Paper

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