Linewidth dependence of grain structure and stress in damascene Cu lines

Journal of Applied Physics

Volumn 99, Issue 2, 2006, Pages

  Paik, Jong Min ^a   Park, Il Mok ^a   Joo, Young Chang ^a   Park, Ki Chul ^b  

^a Seoul National University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AL INTERCONNECTS; DAMASCENE CU INTERCONNECTS; HYDROSTATIC STRESS; STRESS BEHAVIOR;

COMPUTER SIMULATION; CRYSTAL MICROSTRUCTURE; FINITE ELEMENT METHOD; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HYDROSTATIC PRESSURE; STRESSES; THERMAL EXPANSION; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

COPPER;

EID: 31644432003     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2164535     Document Type: Article

References (29)

1. C. K. Hu, B. Luther, F. B. Kaufman, J. Hummel, C. Uzoh, and D. J. Person, Thin Solid Films 262, 84 (1994).
2. S. Venkatesan, Tech. Dig. - Int. Electron Devices Meet. 1997, 769.
3. D. Edelstein, Tech. Dig. - Int. Electron Devices Meet. 1997, 773.
4. P. R. Besser, J. Electron. Mater. 30, 320 (2001).
5. Q. T. Jiang, M. Nowell, B. Foran, A. Frank, R. H. Havemann, V. Parihar, R. A. Augur, and J. D. Luttermer, J. Electron. Mater. 31, 10 (2001).
6. H. Lee, S. S. Wong, and S. D. Lopatin, J. Appl. Phys. 93, 3796 (2003).
7. J. M. Paik, K. C. Park, and Y. C. Joo, J. Electron. Mater. 33, 48 (2004).
8. T. D. Sullivan, Annu. Rev. Mater. Sci. 26, 333 (1996).
9. T. Hosoda, H. Niwa, H. Yagi, and H. Tsuchikawa, Proc. Int. Rel. Phys. Symp. 29, 77 (1991).
10. S. H. Rhee, Ph.D. dissertation, The University of Texas at Austin, Austin, TX, 2000.
11. D. Winter and P. R. Besser, Mater. Res. Soc. Symp. Proc. 563, 201 (1999).
12. ABAQUS, Version 6.2, general purpose finite element program, Habbit, Karlson, and Sorensen, Inc., Pawtucket, RI, 2001.
13. S. H. Rhee, Y. Du, and P. S. Ho, J. Appl. Phys. 93, 3926 (2003).
14. R. R. Reeber and K. Wang, Mater. Chem. Phys. 46, 259 (1996).
15. Landolt-Bornstein: Numerical Data and Functional Relationships in Science and Technology, New Series, Group III, edited by, K. H. Hellwege, and, A. M. Hellwege, Vol. 1 (Springer, Berlin, 1966).
16. Encyclopedia of Materials Science and Engineering, edited by, M. B. Bever, (Pergamon, New York, 1986).
17. Smithells Metals Reference Book, 7th ed., edited by, E. A. Brandes, and, G. B. Brook, (Butterworth-Heinemann, Boston, 1999).
18. Y. L. Shen, S. Suresh, and I. A. Blech, J. Appl. Phys. 80, 1388 (1996).
19. P. H. Townsend, Mater. Res. Soc. Symp. Proc. 476, 9 (1997).
20. J. K. Jung, N. M. Hwang, Y. J. Park, and Y. C. Joo, Jpn. J. Appl. Phys., Part 1 43, 3346 (2004).
21. J. K. Jung, N. M. Hwang, Y. J. Park, and Y. C. Joo, J. Electron. Mater. 34, 559 (2005).
22. J. M. Paik, H. Park, K. C. Park, and Y. C. Joo, J. Appl. Phys. 97, 104513 (2005).
23. J. M. Paik, H. Park, K. C. Park, and Y. C. Joo, Mater. Res. Soc. Symp. Proc. 795, U6.2 (2003).
24. P. A. Flinn, Mater. Res. Bull. 20, 70 (1995).
25. K. Hinode, I. Asano, T. Ishba, and Y. Homma, J. Vac. Sci. Technol. B 8, 495 (1990).
26. N. Yamamoto and S. Sakata, Jpn. J. Appl. Phys., Part 2 2 34, L664 (1995).
27. S. P. Hau-Riege and C. V. Thompson, Appl. Phys. Lett. 76, 309 (2000).
28. E. T. Ogawa, J. W. Mcpherson, J. A. Rosal, K. J. Dickerson, T.-C. Chiu, L. Y. Tsuing, M. K. Jain, T. D. Bonifield, J. C. Ondrusek, and W. R. McKee, Reliability Physics Symposium Proceedings 2002, 40th Annual 2002 IEEE International, 7-11 April 2002, pp. 312-331.
29. K. Y. Y. Doong, R. C. J. Wang, S. C. Lin, L. J. Hung, S. Y. Lee, C. C. Chiu, D. Su, K. Wu, K. L. Young, and Y. K. Peng, Reliability Physics Symposium Proceedings, 2003, 41st Annual. 2003 IEEE International, 30 March - 4 April 2003, pp. 156-160.