Grain growth simulation of damascene interconnects: Effect of overburden thickness

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 6 A, 2004, Pages 3346-3352

  Jung, Jung Kyu ^a   Hwang, Nong Moon ^a   Park, Young Joon ^b   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

Computer simulation; Damascene structure; Grain growth; Monte Carlo method; Triple junction point

Indexed keywords

ALUMINUM; COMPUTER SIMULATION; GRAIN GROWTH; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MONTE CARLO METHODS; REACTIVE ION ETCHING; THIN FILMS;

DAMASCENE STRUCTURES; MODIFIED POTTS MODEL; TRENCH WIDTH; TRIPLE JUNCTION POINT;

INTERCONNECTION NETWORKS;

EID: 4344630072     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.3346     Document Type: Article

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