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Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 559-563

Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness

(4) Jung, Jung Kyu a Hwang, Nong Moon a Paek, Young Joon b Joo, Young Chang a

a Seoul National University (South Korea)

b Korea Institute of Science and Technology (South Korea)

Author keywords

Cu damascene interconnects; Microstructure; Three dimensional simulation

Indexed keywords

COPPER; CRYSTAL STRUCTURE; ELECTRIC PROPERTIES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; POLYCRYSTALLINE MATERIALS; RELIABILITY; THICKNESS MEASUREMENT; THREE DIMENSIONAL;

CU DAMASCENE INTERCONNECTS; MICROSTRUCTURE EVOLUTION; POLYCRYSTALLINE STRUCTURE; THREE-DIMENSIONAL SIMULATION;

OPTICAL INTERCONNECTS;

EID: 20344361944 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-005-0065-x Document Type: Conference Paper

Times cited : (11)

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