Effect of dielectric materials on stress-induced damage modes in damascene Cu lines

Materials Research Society Symposium - Proceedings

Volumn 795, Issue , 2003, Pages 181-186

  Paik, Jong Min ^a   Park, Hyun ^a   Park, Ki Chul ^b   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CHEMICAL MECHANICAL POLISHING; DEFORMATION; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; INTEGRATION; STRESS ANALYSIS; THERMAL EXPANSION; X RAY DIFFRACTION;

DAMASCENE; HYDROSTATIC STRESSES; LOW-K MATERIALS; STRESS-INDUCED DAMAGE;

COPPER;

EID: 2442539133     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u6.2     Document Type: Conference Paper

References (6)

1. D. Edelstein et al., Tech. Dig. - Int. Electron Devices Meet., 773 (1997)
2. Seung-Hyun Rhee, Yong Du, and Paul S. Ho, J. Appl. Phys., 93, 3926 (2003)
3. E. T. Ogawa, J. W. Mcpherson, J. A. Rosal, K. J. Dickerson, T. -C. Chiu, L. Y. Tsuing, M. K. Jain, T. D. Bonifield, J. C. Ondrusek, W. R. McKee, IEEE International Reliability Physics Symposium Proceedings 40th Annual, 312 (2002)
4. M. Saran, R. Cox, C. Martin, G. Ryan, T. Kudoh, M. Kanasugi, J. Hortaleza, M. Ibnabdeljalil, and M. Murtuza, IEEE International Reliability Physics Symposium Proceedings 36th Annual, 225 (1998)
5. ABAQUS, Version 6.2, general purpose finite element program, Hibbit, Karlson, and Sorensen, INC., Pawtucket, RI (2001).
6. Seung-Hyun Rhee and Paul S. Ho, J. Mater. Res., 18, 848 (2003).