Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals

Journal of Electronic Materials

Volumn 31, Issue 1, 2002, Pages 10-15

  Jiang, Qing Tang ^a,b   Nowell, Matt ^c   Foran, Brendan ^a   Frank, Aaron ^b   Havemann, R H ^d   Parihar, Vijay ^e   Augur, R A ^a,f   Luttmer, J D ^b  

^a SEMATECH   (United States)

^b TEXAS INSTRUMENTS   (United States)

^c TSL Inc   (United States)

^d Novellus Systems   (United States)

^e MATTSON THERMAL PRODUCTS GMBH   (United States)

^f NXP SEMICONDUCTORS   (Netherlands)

Author keywords

Anneal; Crystallographic orientation; Damascene Cu line; Grain growth; Grain size; Resistance

Indexed keywords

FURNACES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; RAPID THERMAL ANNEALING; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

CRYSTALLOGRAPHIC ORIENTATION; DAMASCENE CU LINE; TRENCH WIDTH;

COPPER COMPOUNDS;

EID: 28844492802     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0166-8     Document Type: Article

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