X-ray diffraction determination of texture and stress in damascene fabricated copper interconnects

Materials Research Society Symposium - Proceedings

Volumn 563, Issue , 1999, Pages 201-206

  Winter, Delrose ^a   Besser, Paul R ^b  

^a AMIA Laboratories (Advanced Materials Instruments and Analysis Inc)   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL LATTICES; CRYSTAL ORIENTATION; METALLOGRAPHIC MICROSTRUCTURE; STRESSES; X RAY DIFFRACTION ANALYSIS;

DAMASCENE COPPER; LATTICE SPACING;

ELECTRIC CONTACTS;

EID: 0033284878     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-563-201     Document Type: Article

References (3)

1. R.P. Vinci, E.M. Zielinski, and J.C. Bravman, Thin Solid Films 262, 142 (1995)
2. W.D. Nix., Met. Trans. A, Vol. 20A, 2217 (1989).
3. P.R. Besser, Y-C Joo, D. Winter, M. Ngo and R. Ortega, To be published in MRS Symp. Proc. Vol. 563 (1999).