Investigation of Au/Ti/Al ohmic contact to N-type 4H-SiC

Solid-State Electronics

Volumn 49, Issue 12, 2005, Pages 1937-1941

  Chang, Shu Cheng ^a   Wang, Shui Jinn ^a   Uang, Kai Ming ^a,b   Liou, Bor Wen ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b WUFENG INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Ohmic contact; Silicon carbide; Specific contact resistance; Thermal stability

Indexed keywords

AGING OF MATERIALS; ALUMINUM; GOLD; INTERFACES (MATERIALS); SILICON CARBIDE; THERMODYNAMIC STABILITY; TITANIUM; TITANIUM COMPOUNDS; X RAY DIFFRACTION;

LOW RESISTANCE; SPECIFIC CONTACT RESISTANCE; THERMAL AGING; THERMAL ANNEALING;

OHMIC CONTACTS;

EID: 28044465437     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2005.08.013     Document Type: Article

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