Reversible stress changes at all stages of Volmer-Weber film growth

Journal of Applied Physics

Volumn 95, Issue 3, 2004, Pages 1011-1020

  Friesen, C ^a   Seel, S C ^a,b   Thompson, C V ^a  

^a Massachusetts Institute of Technology   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; COALESCENCE; COPPER; DEPOSITION; GRAIN BOUNDARIES; INTERFACIAL ENERGY; MECHANICAL VARIABLES MEASUREMENT; MOLECULAR DYNAMICS; NUCLEATION; POLYCRYSTALLINE MATERIALS; STRESSES; THERMAL EFFECTS;

INTERACTION ENERGY; POLYCRYSTALLINE COPPER FILMS; REVERSIBLE STRESS CHANGE; VOLMER-WEBER FILM GROWTH;

FILM GROWTH;

EID: 1142292391     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1637728     Document Type: Article

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