Nanometre gaps in gold wires are formed by thermal migration

Nanotechnology

Volumn 16, Issue 8, 2005, Pages 1294-1299

  Ramachandran, Ganesh K ^a   Edelstein, Monica D ^a   Blackburn, David L ^a   Suehle, John S ^a   Vogel, Eric M ^a   Richter, Curt A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRIC RESISTANCE; ELECTRON TRANSITIONS; ENERGY GAP; HEATING; NANOTECHNOLOGY; THERMIONIC POWER GENERATION; WIRE;

GOLD WIRES; MOLECULAR ELECTRONICS; NANOMETER GAPS; THERMAL MIGRATION;

GOLD;

EID: 21144448820     PISSN: 09574484     EISSN: None     Source Type: Journal    
DOI: 10.1088/0957-4484/16/8/052     Document Type: Article

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