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Volumn 97-98, Issue , 2002, Pages 173-178

Novel surface-micromachined low-power fuses for on-chip calibration

Author keywords

Low power fuse; Polysilicon fuse; Sensor calibration; Surface micromachining

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; MICROMACHINING; POLYSILICON; PROM;

EID: 0036544161     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00035-3     Document Type: Conference Paper
Times cited : (7)

References (11)
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    • Narosa Publishing House, New Delhi
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    • Das, S.1    Lahiri, S.K.2
  • 6
    • 0009712885 scopus 로고    scopus 로고
    • KP120 data sheet
  • 9
    • 0020267719 scopus 로고
    • Redundancy - The new device technology for circuits of the 80's, IDEM Tech. Dig.
    • (1982) , pp. 608-611
    • Smith, R.J.1
  • 10
    • 0030080836 scopus 로고    scopus 로고
    • Large area MOS-gate power devices using fuible link technology, IEEE Trans. Electron. Devices
    • (1996) , vol.43 , Issue.2 , pp. 347-351
    • Venkatraman, P.1
  • 11
    • 0026961419 scopus 로고    scopus 로고
    • Thermal microassambly of narrow-gap electrostatic comb-drive structures, in: Proceedings of the IEEE solid-state sensor and actuator workshop, Hilton Head Island, SC, June 1992
    • Fedder, G.K.1    Chang, J.C.2    Howe, R.T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.