Analysis of failure mechanisms in electrically stressed gold nanowires

Ultramicroscopy

Volumn 82, Issue 1-4, 2000, Pages 125-133

  Durkan, C ^a   Welland, M E ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Diffusion; Electromigration; Transport

Indexed keywords

CURRENT DENSITY; DIFFUSION; FAILURE ANALYSIS; MATHEMATICAL MODELS; NANOSTRUCTURED MATERIALS; POLYCRYSTALLINE MATERIALS; STRESS ANALYSIS; THERMAL STRESS; THIN FILMS; WIRE;

ELECTROMIGRATION;

GOLD;

GOLD; NANOPARTICLE;

ANALYTIC METHOD; ARTICLE; ELECTRIC CURRENT; ELECTRICITY; ELECTRON TRANSPORT; FILM; PARTICLE SIZE;

EID: 0033967777     PISSN: 03043991     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0304-3991(99)00133-3     Document Type: Article

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