Analysis of failure mechanisms in electrically stressed Au nanowires

Journal of Applied Physics

Volumn 86, Issue 3, 1999, Pages 1280-1286

  Durkan, C ^a   Schneider, M A ^a   Welland, M E ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CURRENT DENSITY; ELECTROMIGRATION; ELECTRON BEAM LITHOGRAPHY; FAILURE ANALYSIS; GOLD; GRAIN BOUNDARIES; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS; SCANNING ELECTRON MICROSCOPY; THIN FILMS; WIRE;

NANOWIRES; THIN FILM INTERCONNECTS;

METALLIC FILMS;

EID: 0032615341     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.370882     Document Type: Article

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