The coupling effect of interfacial adhesion and tensile residual stress on a thin membrane adhered to a flat punch

Journal of Micromechanics and Microengineering

Volumn 15, Issue 4, 2005, Pages 778-784

  Wan, Kai Tak ^a   Kogut, Lior ^b  

^a Architectural and Environmental Engineering   (United States)

^b UNIVERSITY OF WESTERN ONTARIO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CAPACITANCE; DELAMINATION; DIELECTRIC FILMS; INTERFACES (MATERIALS); MONOLAYERS; RESIDUAL STRESSES; SELF ASSEMBLY; STICTION; SURFACE TREATMENT; THIN FILMS;

ADHESION ENERGY; INTERFACIAL ADHESION; MICRODEVICES; THIN MEMBRANES;

MICROELECTROMECHANICAL DEVICES;

EID: 17444380097     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/4/015     Document Type: Article

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