Polysilicon surface-modification technique to reduce sticking of microstructures

Sensors and Actuators, A: Physical

Volumn 52, Issue 1-3, 1996, Pages 145-150

  Yee, Youngjoo ^a   Chun, Kukjin ^a   Lee, Jong Duk ^a   Kim, Chang Jin ^b  

^a Seoul National University   (South Korea)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Grain holes; Polysilicon; Sticking; Surface micromachining; Surface modification

Indexed keywords

DEPOSITION; DRY ETCHING; MICROMACHINING; MICROSTRUCTURE; PHOTOLITHOGRAPHY; SILICON; SUBSTRATES; SURFACE ROUGHNESS; SURFACE TREATMENT; THIN FILMS;

POLYSILICON; SURFACE MICROMACHINING;

MICROELECTROMECHANICAL DEVICES;

EID: 0030103593     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-4247(96)80140-3     Document Type: Article

References (10)

1. C.H. Mastrangelo and C.H. Hsu, Mechanical stability and adhesion of microstructures under capillary forces - Part I: basic theory, J. Microelectromech. Syst., 2 (1993) 33-43.
2. R. Legtenberg, J. Elders and M. Elwenspoek, Stiction of surface micromachined structures after rinsing and drying: model and investigation of adhesion mechanisms, 7th Int. Conf. Solid-State Sensors and Actuators (Transducers '93), Yokohama, Japan, 7-10 June, 1993, pp. 198-201.
3. G.T. Mulhern, D.S. Soane and R.T. Howe, Supercritical carbon dioxide drying of microstructures, 7th Int. Conf. Solid-State Sensors and Actuators (Transducers '93), Yokohama, Japan, 7-10 June, 1993, pp. 296-299.
4. T. Abe, W.C. Messner and M.L. Reed, Effective methods to prevent stiction during post-release-etch processing, Proc. IEEE Micro Electro Mechanical Systems, Amsterdam, Netherlands, January 1995, pp. 94-99.
5. R.L. Alley, P. Mai, K. Komvopoulos and R.T. Howe, Surface roughness modification of interfacial contacts in polysilicon microstructures, 7th Int. Conf. Solid-State Sensors and Actuators (Transducers '93, Yokohama, Japan, 7-10 June, 1993, pp. 288-291.
6. Y. Yee, S. Yu, K. Chun and J.D. Lee, The novel capacitor structure with polysilicon grain hole for advanced dynamic random access memory, Jpn. J. Appl. Phys., 33 (Part 1) (1994) 578-580.
7. T. Kamins, Polycrystalline Silicon for Integrated Circuit Applications, Kluwer, Dordrecht, 1987.
8. W.D. Pilkey, Formulas for Stress, Strain and Structural Matrices, John Wiley, New York, 1994.
9. Y. Yee, K. Chun and J.D. Lee, Polysilicon surface modification technique to reduce sticking of microstructures, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators, Transducers '95, Stockholm, Sweden, 1995, Vol. 1, p. 207.
10. A.W. Adamson, Physical Chemistry of Surfaces, John Wiley, New York, 4th edn., 1982, Ch. 9.