A thermomechanical model for adhesion reduction of MEMS cantilevers

Journal of Microelectromechanical Systems

Volumn 11, Issue 5, 2002, Pages 512-520

  Rogers, James W ^a   Mackin, Thomas J ^a   Phinney, Leslie M ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

Adhesion; Fracture mechanics; Laser repair; Stiction; Thermomechanical model

Indexed keywords

ADHESION; FRACTURE MECHANICS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; LASER APPLICATIONS; MATHEMATICAL MODELS; POLYSILICON; STICTION; THERMAL EFFECTS;

ADHESION REDUCTION; LASER REPAIR; MICROCANTILEVERS; THERMOMECHANICAL MODEL;

MICROELECTROMECHANICAL DEVICES;

EID: 0036772461     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2002.803412     Document Type: Article

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