Reliability of vacuum packaged MEMS gyroscopes

Microelectronics Reliability

Volumn 45, Issue 2, 2005, Pages 361-369

  Choa, S H ^a,b  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^b Seodaemu Gu Seoul 120 101 Korea ^*  (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

MEMS GYROSCOPE SENSORS; MICRO-ELECTRO- MECHANICAL SYSTEM (MEMS); VACUUM PACKAGING; VIBRATION QUANTIFICATION TEST;

BONDING; COATINGS; DEPOSITION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; RELIABILITY; SENSORS; VACUUM APPLICATIONS; VIBRATIONS (MECHANICAL);

GYROSCOPES;

EID: 11344275297     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.05.028     Document Type: Conference Paper

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