Mechanical reliability of MEMS-structures under shock load

Microelectronics Reliability

Volumn 41, Issue 9-10, 2001, Pages 1657-1662

  Wagner, U ^a   Franz, J ^a   Schweiker, M ^a   Bernhard, W ^a   Muller Fiedler R ^a   Michel, B ^b   Paul, O ^c  

^a ROBERT BOSCH GMBH   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; FINITE ELEMENT METHOD; FRICTION; KINETIC ENERGY; LOADS (FORCES); MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; POLYSILICON; SHOCK TESTING; STRESS ANALYSIS;

DROP TESTS; SHOCK LOADS;

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0035457041     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00173-1     Document Type: Article

References (8)

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