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Volumn 36, Issue 4 SUPPL. B, 1997, Pages 2470-2476
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Characteristics of very high-aspect-ratio contact hole etching
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Author keywords
Bowing; CHF3 CO gas; Contact hole etching; Fluorocarbon plasma; High aspect ratio; Magnetically enhanced reactive ion etching; RIE lag
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Indexed keywords
POLYSILICON MASKS;
ASPECT RATIO;
BENDING (FORMING);
FLUORINE CONTAINING POLYMERS;
FLUOROCARBONS;
ION BOMBARDMENT;
MASKS;
REACTIVE ION ETCHING;
SEMICONDUCTING SILICON;
SPUTTER DEPOSITION;
SILICA;
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EID: 0031118260
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.36.2470 Document Type: Article |
Times cited : (47)
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References (16)
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