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Volumn 36, Issue 4 SUPPL. B, 1997, Pages 2470-2476

Characteristics of very high-aspect-ratio contact hole etching

Author keywords

Bowing; CHF3 CO gas; Contact hole etching; Fluorocarbon plasma; High aspect ratio; Magnetically enhanced reactive ion etching; RIE lag

Indexed keywords

POLYSILICON MASKS;

EID: 0031118260     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.2470     Document Type: Article
Times cited : (47)

References (16)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.