Calibration of ESCAP resist simulation parameters from consideration of printed CD pitch bias, CD measurement offset and wafer thermal history

Proceedings of SPIE-The International Society for Optical Engineering

Volumn 4690 II, Issue , 2002, Pages 952-962

  Robertson, Stewart A ^a   Kang, Doris ^a   Tye, Steven D ^a   Hansen, Steven G ^b   Fumar Pici, Anita ^b   Chiou, Tsann Bim ^c   Byers, Jeffery D ^d   Mack, Chris A ^d   Smith, Mark D ^d  

^a SHIPLEY COMPANY   (United States)

^b ASML US Inc   (United States)

^c ASML Taiwan Ltd   (Taiwan)

^d KLA Tencor Austin   (United States)

Author keywords

Heat transfer; Hotplate; Lithography simulation; Measurement offset; Model calibration

Indexed keywords

CALIBRATION; COMPUTER SIMULATION; DIFFUSION; ERROR ANALYSIS; OPTIMIZATION; PHOTOLITHOGRAPHY; THERMOANALYSIS; TUNING;

ACID DIFFUSION;

PHOTORESISTS;

EID: 0036029880     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.474170     Document Type: Article

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