Characteristics of fluorinated amorphous carbon films and implementation of 0.15 μm Cu/a-C:F damascene interconnection

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 3, 2001, Pages 780-787

  Shieh, Jia Min ^a   Suen, Shich Chang ^a   Tsai, Kou Chiang ^a   Dai, Bau Tong ^a   Wu, Yew Chung ^b   Wu, Yu Hen ^b  

^a NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; ETCHING; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC STABILITY; X RAY PHOTOELECTRON SPECTROSCOPY;

AMORPHOUS CARBON FILMS;

AMORPHOUS FILMS;

EID: 0035326480     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1362683     Document Type: Conference Paper

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