Role of passivation etch polymers in interfacial delamination for polymeric low-k dielectrics

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 3, 2000, Pages 1314-1321

  Breen, M R ^a   Foster, C M ^a   Bass, S ^a   Lee, J J ^b   Mlynko, W ^c  

^a ADVANCED MICRO DEVICES   (United States)

^b MOTOROLA INC   (United States)

^c SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; COPPER; DELAMINATION; INTERFACES (MATERIALS); PASSIVATION; PLASMA ETCHING; POLYMERS;

CHEMICAL MECHANICAL POLISHING (CMP);

DIELECTRIC MATERIALS;

EID: 0034186869     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.591380     Document Type: Article

References (24)

1. National Technology Roadmap for Semiconductors (Semiconductor Industry Association, San Jose, CA, 1997), p. 13.
2. Reference 1, pp. 99-105.
3. D. C. Edelstein, Proceedings of the 12th International VLSI Multilevel Interconnection Conference (VMIC), 1995, pp. 301-307.
4. M. Chow et al., U.S. Patent 4 702 792 (1987); U.S. Patent 4 789 648 (1988); K. D. Beyer et al., U.S. Patent 4 944 836 (1990).
5. M. Chow et al., U.S. Patent 4 702 792 (1987); U.S. Patent 4 789 648 (1988); K. D. Beyer et al., U.S. Patent 4 944 836 (1990).
6. M. Chow et al., U.S. Patent 4 702 792 (1987); U.S. Patent 4 789 648 (1988); K. D. Beyer et al., U.S. Patent 4 944 836 (1990).
7. C. W. Kaanta et al., Proceedings of the 8th IEEE VI Multilevel Interconnection Conference, 1991, p. 144.
8. H. Landis et al., Thin Solid Films 220, 1 (1992).
9. B. Luther et al., Proceedings of the 10th International VLSI Multilevel Interconnection Conference (VMIC), 1993, p. 15.
10. T. Ryan et al., Low-k Material Module Evaluation Report, SEMATECH J105 Report, 1998.
11. L. Peters, Semicond. Int. 10, 64 (1998).
12. M. R. Baklanov, S. Vanhaelemeersch, H. Bender, and K. Maex, J. Vac. Sci. Technol. B 17, 372 (1999).
13. T. E. F. M. Standaert, P. J. Matsuo, S. D. Allen, G. S. Oehrlein, T. J. Dalton, T.-M. Lu, and R. Gutmann, Mater. Res. Soc. Symp. Proc. 511, 265 (1998).
14. D. Brown, Mater. Res. Soc. Symp. Proc. 516, 135 (1998).
15. M. E. Gross, C. Lingk, W. L. Brown, and R. Drese, Solid State Technol. 8, 47 (1999).
16. S. Fang, C. Chiang, D. Frazer, B. Lee, P. Keswick, M. Chang, and K. Fung, J. Vac. Sci. Technol. A 14, 1092 (1996).
17. P. Singer, Semicond. Int. 9, 69 (1999).
18. D. Sesler, 844AZ Reticle Specification (SEMATECH, Austin, TX, 1998).
19. S. M. Hues and C. M. Davin, in Secondary Ion Mass Spectrometry SIMS XI, edited by G. Gillen et al. (1998), p. 225.
20. L. H. Lee, Fundamentals of Adhesion (Plenum, New York, 1991).
21. A. J. Kinloch, J. Mater. Sci. 15, 2141 (1980).
22. A. J. Kinloch, J. Mater. Sci. 17, 617 (1982).
23. J. G. Newman, B. A. Carlson, R. S. Michael, J. F. Moulder, and T. A. Hohlt, Static SIMS Handbook of Polymer Analysis (Perkin Elmer, Eden Prairie, 1991), pp. 136-158.
24. A. Benninghoven, F. G. Ruedenauer, and H. W. Warner, Secondary Ion Mass Spectrometry (Wiley, New York, 1987), pp. 243-247.