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Sensors and Actuators: A. Physical

Volumn 37-38, Issue C, 1993, Pages 61-67

Anodic bonding of silicon to silicon wafers coated with aluminium, silicon oxide, polysilicon or silicon nitride

(2) Nese, Martin a Hanneborg, Anders a

a UNIVERSITY OF OSLO (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; BOROSILICATE GLASS; COATINGS; FILMS; MATERIALS TESTING; MINIATURE INSTRUMENTS; MOUNTINGS; NONDESTRUCTIVE EXAMINATION; SEMICONDUCTING SILICON; SPUTTER DEPOSITION; STRENGTH OF MATERIALS; WSI CIRCUITS;

ANODIC BONDING; BOND STRENGTH; BOROSILICATE FILMS; LIQUID NITROGEN; MEDIA COMPATIBILITY; MICROMECHANICAL COMPONENTS; MOUNTING METHOD; SILICON TO SILICON WAFERS; THERMAL SHOCK TESTING;

SILICON SENSORS;

EID: 0027611874 PISSN: 09244247 EISSN: None Source Type: Journal
DOI: 10.1016/0924-4247(93)80013-7 Document Type: Article

Times cited : (54)

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