Pressure leakage through material interfaces in pressure sensor packages

American Society of Mechanical Engineers, Manufacturing Engineering Division, MED

Volumn 3, Issue , 1995, Pages 87-93

  Monk, D J ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); LEAKAGE (FLUID); ORGANIC POLYMERS; SENSORS; THERMAL EFFECTS; THERMAL EXPANSION;

PRESSURE LEAKAGE; PRESSURE SENSOR PACKAGES;

PRESSURE GAGES;

EID: 0029425221     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)