|
|
Volumn 390, Issue , 1995, Pages 103-109
|
|
Thin film polymer stress measurement using piezoresistive anisotropically etched pressure sensors
a
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ANNEALING;
ELASTIC MODULI;
ELECTRIC PROPERTIES;
MECHANICAL PROPERTIES;
MECHANICAL VARIABLES MEASUREMENT;
MODIFICATION;
POLYMERS;
PROTECTIVE COATINGS;
SILICON;
STRESSES;
THIN FILMS;
COATING MODULUS;
COEFFICIENT OF THERMAL EXPANSION;
FILM STRESS;
PIEZORESISTIVE ANISOTROPICALLY ETCHED PRESSURE SENSORS;
POLYMER CRYSTALLINITY;
THIN CONFORMAL POLYMERIC COATING;
THIN FILM POLYMER STRESS MEASUREMENT;
WAFER BOWING;
SILICON SENSORS;
|
|
EID: 0029190459
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-390-103 Document Type: Conference Paper |
|
Times cited : (3)
|
|
References (32)
|
