Silicon-to-thin film anodic bonding

Journal of Micromechanics and Microengineering

Volumn 2, Issue 3, 1992, Pages 117-121

  Hanneborg, A ^a   Nese, M ^a   Jakobsen, H ^b   Holm, R ^b  

^a Central Institute for Industrial Research   (Norway)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC BONDING; BOND STRENGTH; INFRARED MICROSCOPY; SILICON-TO-THIN FILM BONDING;

BONDING; INSPECTION; MICROSCOPIC EXAMINATION; PRESSURE TRANSDUCERS; SPUTTERING; THIN FILMS;

SILICON SENSORS;

EID: 0026917658     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/2/3/002     Document Type: Review

References (28)

1. Direct-Current Polarization During Field-Assisted Glass-Metal Sealing
2. A batch-fabricated silicon accelerometer
3. A high-sensitivity integrated-circuit capacitive pressure transducer