Thin film polymer stress measurement using piezoresistive anisotropically etched pressure sensors

Materials Research Society Symposium - Proceedings

Volumn 436, Issue , 1996, Pages

  Bitko, G ^a   Harries, R ^a   Matkin, J ^a   McNeil, A C ^a   Monk, D J ^a   Shah, M ^a   Wertz, J ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ELASTIC MODULI; FINITE ELEMENT METHOD; HIGH TEMPERATURE EFFECTS; POLYMERS; SENSORS; STRAIN MEASUREMENT; STRESSES; THERMAL STRESS;

DEVICE ENCAPSULATION; PARYLENE; PIEZORESISTIVE ANISOTROPICALLY ETCHED PRESSURE SENSORS; STRESS MEASUREMENT; THIN POLYMER FILMS;

THIN FILMS;

EID: 0030391988     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-436-365     Document Type: Conference Review

References (18)