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Volumn 22, Issue 1, 1994, Pages 39-67
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The challenges for hermetic encapsulation of implanted devices - A review
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Author keywords
[No Author keywords available]
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Indexed keywords
ARTICLE;
CATHETER;
CONTAMINATION;
ENCAPSULATION;
GUIDE WIRE;
IMPLANTATION;
MATHEMATICAL ANALYSIS;
PACKAGING;
PRIORITY JOURNAL;
SEMICONDUCTOR;
SENSOR;
TECHNICAL AID;
WATER VAPOR;
ANIMAL;
BIOCOMPATIBLE MATERIALS;
CORROSION;
DIFFUSION;
ELECTROLYTES;
EQUIPMENT DESIGN;
EQUIPMENT FAILURE;
HUMAN;
METALS;
OSMOSIS;
PACEMAKER, ARTIFICIAL;
POLYMERS;
PROSTHESES AND IMPLANTS;
PROSTHESIS DESIGN;
WATER;
BIOMEDICAL ENGINEERING;
BIOSENSORS;
ELECTRONICS PACKAGING;
IMPLANTS (SURGICAL);
INTEGRATED CIRCUITS;
PLASTICS APPLICATIONS;
HERMETIC ENCAPSULATION;
IMPLANTED DEVICES;
ENCAPSULATION;
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EID: 0028670785
PISSN: 0278940X
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (40)
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References (0)
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