Silicon-to-silicon anodic bonding with a borosilicate glass layer

Journal of Micromechanics and Microengineering

Volumn 1, Issue 3, 1991, Pages 139-144

  Hanneborg, A ^a   Nese, M ^a   Ohlckers, P ^a  

^a Central Institute for Industrial Research   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC BONDING; BOROSILICATE GLASS; CATHODIC BONDING; GLASS FILMS; SILICON WAFERS; SILICON-TO-SILICON BONDING;

MICROELECTRONICS; SEMICONDUCTING FILMS; SEMICONDUCTING GLASS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0026225616     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/1/3/002     Document Type: Article

References (29)

1. Low-Temperature Electrostatic Silicon-to-Silicon Seals Using Sputtered Borosilicate Glass
2. Direct-Current Polarization During Field-Assisted Glass-Metal Sealing