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Advanced Materials

Volumn 11, Issue 17, 1999, Pages 1409-1425

Wafer bonding and layer splitting for microsystems

(2) Tong, Qin Yi a,c Gösele, Ulrich M b,c

a RTI INTERNATIONAL (United States)

b MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS (Germany)

c Duke University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 9744270951 PISSN: 09359648 EISSN: None Source Type: Journal
DOI: 10.1002/(SICI)1521-4095(199912)11:17<1409::AID-ADMA1409>3.0.CO;2-W Document Type: Article

Times cited : (127)

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