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1
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33847145908
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A 0.14 mW/Gbps high-density capacitive interface for 3-D system integration
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A. Fazzi, L. Magagni, M. Mirandola, R. Canegallo, S. Schmitz, and R. Guerrieri, “A 0.14 mW/Gbps high-density capacitive interface for 3-D system integration,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC 2005), 2005, pp. 101–104.
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Proc. IEEE Custom Integrated Circuits Conf. (CICC 2005)
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Fazzi, A.1
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Canegallo, R.4
Schmitz, S.5
Guerrieri, R.6
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2
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34748883633
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3-D capacitive interconnections for wafer-level and die-level assembly
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Oct.
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A. Fazzi, L. Magagni, M. Mirandola, B. Charlet, L. Di Cioccio, E. Jung, R. Canegallo, and R. Guerrieri, “3-D capacitive interconnections for wafer-level and die-level assembly,” IEEE J. Solid-State Circuits, vol. 42, no. 10, pp. 2270–2282, Oct. 2007.
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A. Fazzi, L. Magagni, M. De Dominicis, P. Zoffoli, R. Canegallo, P. L. Rolandi, A. Sangiovanni-Vincentelli, and R. Guerrieri, “Yield prediction for 3-D capacitive interconnections,” in Proc. IEEE/ACM Int. Conf. Computer Aided Design (ICCAD 2006),Nov. 2006, pp. 809–814.
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presented at the, Grenoble, France, Mar.
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B. Charlet, L. Di Cioccio, J. Dechamp, M. Zussy, T. Enot, R. Canegallo, A. Fazzi, and R. Guerrieri, “Chip-to-chip interconnections based on the wireless capacitive coupling for 3-D integration,” presented at the Materials for Advanced Metallizations Conf. (MAM 2006), Grenoble, France, Mar. 2006.
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Materials for Advanced Metallizations Conf. (MAM 2006)
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Charlet, B.1
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E. Jung, S. Schmitz, K. Kaschlun, L. Magagni, A. Fazzi, R. Guerrieri, and R. Canegallo, “3-D integration of hybrid integration of integrated circuits,” presented at the Symp. Design, Test, Integration and Packaging of MEMS/MOEMS, Stresa, Italy, Apr. 26–28, 2006.
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Symp. Design, Test, Integration and Packaging of MEMS/MOEMS
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Jung, E.1
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J. Xu, J. Wilson, S. Mick, L. Luo, and P. Franzon, “2.8 Gb/s inductively coupled interconnect for 3-D ICs,” in Symp. VLSI Circuits Dig. Tech. Papers, 2005, pp. 352–355.
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