A 0.14mW/Gbps high-density capacitive interface for 3D system integration

Proceedings of the Custom Integrated Circuits Conference

Volumn 2005, Issue , 2005, Pages 101-104

  Fazzi, Alberto ^a   Magagni, Luca ^a   Mirandola, Mauro ^a   Canegallo, Roberto ^b   Schmitz, Stefan ^c   Guerrieri, Roberto ^a  

^a UNIVERSITY OF BOLOGNA   (Italy)

^b STMICROELECTRONICS   (Italy)

^c FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY UTILIZATION; INTERCONNECTION NETWORKS; INTERFACES (COMPUTER);

CAPACITIVE COUPLING; POWER CONSUMPTION;

SYSTEMS ANALYSIS;

EID: 33847145908     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CICC.2005.1568618     Document Type: Conference Paper

References (6)

1. Mizoguchi, D. et al. "1.2Gb/s/pin Wireless Superconnect Based on Inductive Inter-Chip Signaling (US)". In ISSCC2004, pp. 142-143, February 2004.
2. Miura, N. et al. "A 195Gb/s 1.2W 3D-Stacked Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme". In ISSCC2005, pp.264-265, February 2005.
3. Kanda, K. et al. "1.27Gb/s/pin 3mW/pin wireless Superconnect (WSC) interface scheme". In ISSCC2003, pp.186-187, February 2003.
4. Drost, R. et al. "Proximity communication". In IEEE J. Solid-State Circuits, Volume 39, Issue 9, pp.1529-1535,September 2004.
5. Luo, L. et al. "3Gp/s AC-Coupled Chip-to-Chip Communication using Low-Swing Pulse Receiver". In ISSCC2005, pp.522-523, February 2005.
6. Mick, S et al. "4 Gbps High-Density AC Coupled Interconnection" . In CICC2002, pp.133-140, May 2002.