AC coupled interconnect for dense 3-D ICs

IEEE Transactions on Nuclear Science

Volumn 51, Issue 5 I, 2004, Pages 2156-2160

  Xu, Jian ^a   Mick, Stephen ^a   Wilson, John ^a   Luo, Lei ^a   Chandrasekar, Karthik ^a   Erickson, Evan ^a   Franzon, Paul D ^a  

^a North Carolina State University   (United States)

Author keywords

AC coupled; Inductive coupling; Spiral inductor; Three dimensional integrated circuits (3 D ICs); Through vias; Vertical interconnect

Indexed keywords

COMPUTER SIMULATION; DIGITAL SIGNAL PROCESSING; ELECTRIC TRANSFORMERS; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; TRANSCEIVERS;

AC COUPLED INTERCONNECTS (ACCI); INDUCTIVE COUPLING; SPIRAL INDUCTORS; THREE-DIMENSIONAL INTEGRATED CIRCUITS (3-D IC); THROUGH VIAS; VERTICAL INTERCONNECTS;

INTEGRATED CIRCUITS;

EID: 8344244692     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNS.2004.834712     Document Type: Article

References (8)

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