Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 6, Issue 4, 2016, Pages 518-526

  Li, Na ^a   Mao, Junfa ^a   Zhao, Wen Sheng ^b   Tang, Min ^a   Chen, Wenchao ^c   Yin, Wen Yan ^a,c  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b HANGZHOU DIANZI UNIVERSITY   (China)

^c ZHEJIANG UNIVERSITY   (China)

Author keywords

Carbon nanotube (CNT); carbon based heterogeneous interconnects; electrostatic discharge (ESD); electrothermal cosimulation; finite element method (FEM); graphene; through silicon via (TSV).

Indexed keywords

CARBON NANOTUBES; ELECTRIC HEATING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; THERMAL CONDUCTIVITY; THREE DIMENSIONAL INTEGRATED CIRCUITS; YARN;

ANISOTROPIC PROPERTY; CARBON NANO-MATERIALS; CARBON NANOTUBE BUNDLE; ELECTRICAL RESISTANCES; MULTILAYER GRAPHENE; ON-CHIP INTERCONNECTS; THERMAL PERFORMANCE; TRANSIENT TEMPERATURE DISTRIBUTIONS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84979465999     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2016.2538298     Document Type: Article

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