Electrical-thermal co-simulation for DC IR-drop analysis of large-scale power delivery

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 4, Issue 2, 2014, Pages 323-331

  Lu, Tianjian ^a   Jin, Jian Ming ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

Electrical thermal co simulation; finite element method; finite element tearing and interconnecting; on chip power grid; parallel computing; power delivery; through silicon vias (TSVs)

Indexed keywords

DOMAIN DECOMPOSITION METHODS; FINITE ELEMENT METHOD; PARALLEL ARCHITECTURES; PARALLEL PROCESSING SYSTEMS;

COSIMULATION; FINITE ELEMENT TEARING AND INTERCONNECTING; ON-CHIP POWER GRIDS; POWER DELIVERY; THROUGH SILICON VIAS;

ELECTRIC POWER TRANSMISSION;

EID: 84894065167     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2275271     Document Type: Article

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