Transient electrical-thermal analysis of 3-D power distribution network with FETI-Enabled parallel computing

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 4, Issue 10, 2014, Pages 1684-1695

  Lu, Tianjian ^a   Jin, Jian Ming ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

3 D power distribution network (PDN); domain decomposition; electrical thermal co simulation; finite element method (FEM); through silicon via (TSV)

Indexed keywords

COMPUTER SIMULATION; DOMAIN DECOMPOSITION METHODS; ELECTRIC NETWORK ANALYSIS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUIT MANUFACTURE; PARALLEL ARCHITECTURES; POWER QUALITY; SOLDERING; THERMOANALYSIS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

COSIMULATION; FINITE ELEMENT TEARING AND INTERCONNECTING; LARGE-SCALE PROBLEM; MULTIPLE PROCESSORS; ON-CHIP POWER GRIDS; PARALLEL EFFICIENCY; POWER DISTRIBUTION NETWORK; THROUGH-SILICON VIA;

FINITE ELEMENT METHOD;

EID: 85027951829     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2014.2345651     Document Type: Article

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