Stacking signal TSV for thermal dissipation in global routing for 3-D IC

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 33, Issue 7, 2014, Pages 1031-1042

  Hsu, Po Yang ^a   Chen, Hsien Te ^a   Hwang, Ting Ting ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

3 D IC; Global routing; stacked signal TSV; thermal dissipation; through silicon via (TSV)

Indexed keywords

THERMOANALYSIS;

BETTER PERFORMANCE; GLOBAL ROUTING; INTEGRATED DESIGNS; LOCATING ALGORITHM; STACKED SIGNAL TSV; TEMPERATURE REDUCTION; THERMAL DISSIPATION; THROUGH-SILICON-VIA (TSV);

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84903203252     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2014.2307488     Document Type: Article

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