Transmission line pulse picosecond imaging circuit analysis methodology for evaluation of ESD and latchup

IEEE International Reliability Physics Symposium Proceedings

Volumn 2003-January, Issue , 2003, Pages 99-104

  Weger, Alan ^a   Voldman, Steven ^b   Stellari, Franco ^a   Song, Peilin ^a   Sanda, Pia ^c   McManus, Moyra ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b TBM Microelectronics   (United States)

^c IBM   (United States)

Author keywords

Electrostatic discharge (ESD); Latchup; Photon emission; Picosecond imaging circuit analysis (PICA); Transmission line pulse (TLP)

Indexed keywords

ELECTRIC NETWORK ANALYSIS; ELECTROSTATIC DEVICES; ELECTROSTATIC DISCHARGE; ELECTROSTATICS; FAILURE ANALYSIS; RECONFIGURABLE HARDWARE; RELIABILITY; RELIABILITY ANALYSIS; SEMICONDUCTOR DEVICES; SILICON WAFERS;

ELECTRICAL CHARACTERIZATION; HIGH-CURRENT PULSE; LATCH-UPS; LATCHUP PHENOMENON; PERIPHERAL CIRCUITS; PHOTON EMISSIONS; PICOSECOND IMAGING CIRCUIT ANALYSIS; TRANSMISSION LINE PULSE;

TIME DOMAIN ANALYSIS;

EID: 84955269175     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2003.1197727     Document Type: Conference Paper

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