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Volumn 43, Issue 2, 2014, Pages 555-566

Low-temperature silicon-to-silicon anodic bonding using sodium-rich glass for MEMS applications

Author keywords

bonding energy; crack opening method; RF sputtering; silicon to silicon anodic bonding; sodium rich glass thin film

Indexed keywords

CAPACITIVE SENSORS; CHEMICAL BONDS; CHEMICAL MECHANICAL POLISHING; CHEMICAL SENSORS; CRACKS; FABRY-PEROT INTERFEROMETERS; GLASS; GLASS BONDING; METAL IONS; PRESSURE SENSORS; SCANNING ELECTRON MICROSCOPY; SODIUM; SPUTTERING; STRESS INTENSITY FACTORS; SURFACE ROUGHNESS; TEMPERATURE; THIN FILMS; WAFER BONDING;

EID: 84897636431     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2844-0     Document Type: Article
Times cited : (7)

References (39)
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  • 33
    • 33744530264 scopus 로고    scopus 로고
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    • J. Wei, J. Phys. Conf. Ser. 34, 943 (2006).
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    • Wei, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.