Low-temperature anodic bonding to silicon nitride

Sensors and Actuators, A: Physical

Volumn 82, Issue 1, 2000, Pages 249-253

  Weichel, S ^a   De Reus, R ^a   Bouaidat, S ^a   Rasmussen, P A ^a   Hansen, O ^a   Birkelund, K ^b   Dirac, H ^b  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b DANFOSS A S   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); DIES; GLASS BONDING; OXIDATION; PLASMA APPLICATIONS; SILICON NITRIDE; TENSILE TESTING;

ANODIC BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0033732615     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00372-6     Document Type: Article

References (14)

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